Bonding method

Flip Chip

Bonding accuracy

8 μm @3s (High Accuracy Mode)

Min. cycle time

240 ms (incl. dip fluxing)

Wafer size

4” to 12”

Frame size

6", 8” and 12”

Die size

0.2 (with small die kit) to 20 mm

Die thickness

≥ 0.05 mm / ≥ 2 mils
(thinner on request)

Strip dimensions

Length up to 500 mm
Width up to 125 mm (flat boats up to 137 mm)